Thank you for participating in WOODRISE 2021 KYOTO.
Approximately 800 people from 18 countries including Japan participated online or onsite. Highly meaningful exchanges of information and opinions took place.
At WOODRISE 2021 BUSINESS SESSION in May 2022, we will hold B to B Meetings, social events and technical tours that were postponed at the Kyoto conference.
We look forward to seeing many people involved in mid-rise and high-rise wooden buildings.
Theme: Wooden Buildings
for Sustainable Development
- From the Traditional to the Future
Dates: May 22 (Sun)–27 (Fri), 2022
*Technical tours will be held in various regions between May 24 (Tue) and 27 (Fri).
Venue: KABUTO ONE (Tokyo)
Dates: May 22 (Sun)–27 (Fri), 2022
Venue: KABUTO ONE (Tokyo)
January 19, 2022
Exhibitions has been updated.
December 22, 2021
Exhibitions has been updated.
November 30, 2021
On-demand streaming has ended.
November 24, 2021
Sponsored session has been uploaded.
November 1, 2021
Ondemand streaming has started.
October 12, 2021
Program and Information for Participants has been uploaded.
October 7, 2021
Details of the Schedule has been uploaded.
October 4, 2021
[Important] The changes of the event has been uploaded.
September 14, 2021
Registration application deadline has been extended.
September 9, 2021
The title of the sponsored session has been updated.
August 6, 2021
Program, Exhibitions, Sponsorrs has been updated.
July 1, 2021
Program has been updated (Program at a Glance, Details of the Technical Workshop & Special Session).
May 28, 2021
Details of the sites of the scheduled visits of Technical Tours has been updated.
May 1, 2021
Greeting, Conference Outline, Program, Social Program, Technical Tours and Registration & Accommodations has been updated.
April 16, 2021
Conference Outline has been updated.
October 2, 2020
Website has been opened.
This program is supported by a subsidy from Kyoto City and the Kyoto Convention & Visitors Bureau.
This program is supported by a subsidy from Kyoto City and the Kyoto Convention & Visitors Bureau.